5-month Engineering, Computer Science and Information Technology WIL Placements in Asia (Singapore and South Korea)!
Program Location: Singapore and South Korea
Program Dates: September 2025 onwards
Application Deadline: Monday 24th March, 2025
Places Available: Up to 11 New Colombo Plan (NCP) funded places in 2025
There is an opportunity for Flinders University Engineering, IT and CS students to go to
Singapore and South Korea for their 5-month (20-weeks) WIL Placement for either
ENGR3710 or STEM3005. Our current partners are Nanyang Polytechnic (NYP) and Vue
Networks in Singapore and Incheon National University in South Korea. Details of the exact
projects that can be undertaken with both WIL Hosts will be posted shortly.
Academic Eligibility and Overview |
|
Area of Study |
Engineering, IT, Computer Science |
Degree type |
Undergraduate 4- and 5- years degrees (inc. Honours) |
Eligibility |
An actively enrolled Flinders student, studying an Engineering, IT or Computer Science degree. Be deemed suitable to represent Flinders University overseas, and have a GPA of 5.0 or higher. |
Language of instruction |
English |
Credit (Academic Recognition) |
Access to a 13.5 unit WIL topic toward their academic program |
GPA |
5.0 above |
Travel Scholarships Available
This program is supported by the Australian Government’s New Colombo Plan (NCP). The cost of this program can be offset by:
- AUD $10,910 Australian Government New Colombo Plan Grant
- OS-HELP up to AUD $9,893 (conditions apply)
To find out more about eligibility, see the New Colombo Plan, and OS-HELP section.
Program Costs (indicative)
The cost of this program depends on where you go in Singapore and South Korea and the accommodation arrangements for your WIL Placement. Successful applicants will receive an Australian Government New Colombo Plan scholarship of AUD$10,910 to cover costs for the 5-months they are away. If you are an undergraduate Australian citizen, the cost of this opportunity can be offset by a OS-HELP loan of up to $9,893 (conditions apply).
The cost will cover:
- Academic support and mentorship for the 20-week program
- A pre-departure meeting here at Flinders University prior to leaving
The cost will not include:
- Flights, accommodation and day-to-day expenses – this is what the New Colombo Plan scholarship is for;
- Visa (students must obtain this documentation)
- Vaccinations/medical arrangements (please consult your medical professional prior to departure for vaccination advice)
- Independent trips, shopping, and meals
Flinders University reserves the right to alter the program cost at any time due to currency fluctuations and/or fee changes made by its partners.
All students that participate in this program will be covered by the university’s travel insurance. Please note this cover is limited. It is advised that you read the Flinders University Travel and Insurance schedule of benefits. Before you go, know what is covered and what is not covered.
Insurance Registration required
How To Apply
All applications should be submitted through InPlace prior to the deadline - 24th March 2025.
All applicants need to:
- submit their CV,
- Academic Transcript (an unofficial version is acceptable) and
- submit a 1-page Expression of Interest (EOI) explaining (a) their motivation for applying to go to Singapore for their WIL Placement, (b) how this will enhance their current studies and future career, and (c) what skills and/or personal attributes they will bring to this important program.
Further Information
Please contact A/Prof David Hobbs (david.hobbs@flinders.edu.au) or Dr Thomas Vincent (thomas.vincent@flinders.edu.au) for detailed information about this Program.
Student Testimonial
Read all about Bethany’s Biomedical Engineering NCP placement experience for what to expect! (https://blogs.flinders.edu.au/student-exchange-experiences/2017/02/10/biomedical-engineering-placement-singapore/)
Bachelor of Engineering (Biomedical) (Honours) / Master of Engineering (Biomedical)
Sturt Rd, Bedford Park
South Australia 5042
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