5-month Engineering and Technology WIL Placements in Singapore!
Program Location: Singapore
Program Dates: July 2024 onwards
Application Deadline: 3rd April 2024
Places Available: Up to 8 New Colombo Plan (NCP) funded places in 2024
Experience the ultimate engineering adventure with Flinders University's 20-week International Work-Integrated Learning (WIL) placements program in Singapore! Partnering with prestigious institutions like Nanyang Polytechnic, along with cutting-edge companies like Fourier Intelligence and Vue Networks, you'll dive deep into industry projects for 5 transformative months. Gain hands-on experience, forge valuable connections, and unlock exciting post-placement opportunities. Elevate your engineering career on a global scale—join us in Singapore and let your ambitions soar!
Academic Eligibility and Overview |
|
Area of Study |
Engineering, IT, Computer Science |
Degree type |
Undergraduate (inc. Honours) |
Eligibility |
An actively enrolled Flinders student, studying an Engineering, IT or Computer Science degree. Be deemed suitable to represent Flinders University overseas, and have a GPA of 5.0 or higher. |
Language of instruction |
English |
Credit (Academic Recognition) |
Access to a 13.5 unit WIL topic toward their academic program |
GPA |
5.0 above |
Travel Scholarships Available
This program is supported by the Australian Government’s New Colombo Plan (NCP). The cost of this program can be offset by:
- AUD $10,910 Australian Government New Colombo Plan Grant
- OS-HELP up to AUD $9,504 (conditions apply)
To find out more about eligibility, see the New Colombo Plan, and OS-HELP section.
Program Costs (indicative)
There are no direct program costs payable to the university. Other costs include, airfare, accommodation, visas, vaccinations, living costs, etc. These costs can be offset by a AUD $10,910 Australian Government New Colombo Plan, and OS-HELP up to $9,504 (conditions apply).
Flinders will provide:
- Academic support and mentorship for the 20-week program
- A pre-departure meeting here at Flinders University prior to leaving for Singapore
Other expected costs include:
- Flights, accommodation, visas, vaccinations and day to day expenses – this is what the New Colombo Plan scholarship is for.
- Visa (students must obtain this documentation)
- Vaccinations/medical arrangements (please consult your medical professional prior to departure for vaccination advice)
- Independent trips, shopping, and meals
Flinders University reserves the right to alter the program cost at any time due to currency fluctuations and/or fee changes made by its partners.
All students that participate in this program will be covered by the university’s travel insurance. Please note this cover is limited. It is advised that you read the Flinders University Travel and Insurance schedule of benefits. Before you go, know what is covered and what is not covered.
Insurance Registration required
How To Apply
All applications should be submitted through InPlace. All applicants are required to:
- submit their CV, and
- submit a 1-page Expression of Interest (EOI) explaining
(a) their motivation for applying to go to Singapore for their WIL Placement, (b) how this will enhance their current studies and future career, and (c) what skills and/or personal attributes they will bring to this important program.
Further Information
Please contact Dr David Hobbs (david.hobbs@flinders.edu.au) for detailed information about this Program.
Student Testimonial
Read all about Bethany’s Biomedical Engineering NCP placement experience for what to expect! (https://blogs.flinders.edu.au/student-exchange-experiences/2017/02/10/biomedical-engineering-placement-singapore/)
Bachelor of Engineering (Biomedical) (Honours) / Master of Engineering (Biomedical)
Sturt Rd, Bedford Park
South Australia 5042
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